HDI PCB
By utilizing advanced production technology and strict quality control system, we ensure that every piece of HDI PCB meets the actual needs of customers. We always adhere to the customer-oriented principle and provide the best service to customers.
HDI (Partial Technology Capability) | |
N/M/N | 4~28L(6 Steps) |
Interconnection of any layer | 16L |
Finished board thickness | 200um~3200um |
Copper Foil Type | VLP. SLP. SLP2 |
Min laser via/pad(um) | 70/140um |
Min buried via diameter/pad(um) | 100/230um |
Min PTH diameter/pad(um) | 100/230um |
Min trace/spacing(um) | 35/35um |
Min solder mask openging(um) | 90um |
Solder mask color | |
Surface Finish |
HASL/ImmersionTin/ImmersionSilver /ImmersionGold/ENEPIG/OSP |
Test | ICT, FCT, AOI, Flying probe test |
For more information, please click 【here】.
FR-4|Advanced PCB
PCB sampling and mass production services from 1 to 42 layers. We use real A-grade plates, adhere to the factory's self-operated production model, and ensure the reliability and stability of quality. Brand new high-rise dedicated production line, the circuit soldering prevention adopts advanced production equipment in the industry such as LDI, VCP pulse plating, etc., uses famous brand plates, precise impedance detection instruments, and provides high-definition characters, high-quality inspection standards, high-end packaging and transportation services.
Multi-Layers(Partial Technology Capability) | ||
Layer count | 1~42L | |
Core thickness(Exclude copper) | 50um | |
Min mechanical hole size | 100um | |
Inner outter layer registration Mini pad Dia. | DHS+6mil | |
Min. S/M dam | 50um | |
Min. S/M opening size | 4mil | |
Via Covering | Epoxy Filled & Untented, Epoxy Filled & Capped,Copper paste Filled & Capped | |
Solder mask color | ||
Solder mask ink thickness | ≧10um | |
Depth-Controlled routing tolerance | ±0.05mm | |
Minimum Legend Width | 6mil(0.15mm) | |
Surface Finish |
HASL/ImmersionTin/ImmersionSilver /ImmersionGold/ENEPIG/OSP |
For more information, please click 【here】.
PTFE Teflon high-frequency board
Partial PCB Process Parameters | |
Base Material | PTFE Teflon |
Layers | 2Layers |
Maximum Dimensions | 590mm*438mm |
PCB Thickness | 0.76mm~1.65mm |
PCB Color | |
Silkscreen | |
Material Type |
ZYF255DA(Dk=2.55,Df=0.0018), ZYF265D(Dk=2.65,Df=0.0019), ZYF300CA-C(Dk=2.94,Df=0.0016), ZYF300CA-P(Dk=3.0,Df=0.0018), [Data Sheet] |
Surface Finish | ENIG |
Gold Thickness | 1μ'', 2μ'' |
Outer Copper Weight | 1oz |
Via Covering | Tented, Untented, Plugged, Epoxy Filled & Capped, Copper Paste Filled & Capped |
Test | AOI, Flying Probe Test |
Rogers high-frequency board
Partial PCB Process Parameters | |
Base Material | Rogers |
Maximum Dimensions | 590mm*438mm |
Layers | 1Layer, 2Layers |
PCB Thickness | 0.5mm~1.6mm |
PCB Color | |
Silkscreen | |
Material Type | RO4350B(Dk=3.48,Df=0.0037) [Data Sheet] |
Surface Finish | ENIG |
Gold Thickness | 1μ'', 2μ'' |
Outer Copper Weight | 1oz |
Via Covering | Tented, Untented, Plugged, Epoxy Filled & Capped, Copper Paste Filled & Capped |
Test | AOI, Flying Probe Test |